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 STB230NH03L
N-channel 30V - 80A - D2PAK STripFETTM Power MOSFET
Features
Type STB230NH03L

VDSS 30V
RDS(on) < 3m
ID 80A(1)
1. This value is limited by package
RDS(on) Qg industry's benchmark Conduction losses reduced Switching losses reduced Low threshold device
1
3
DPAK
Description
This product utilizes the latest advanced design rules of ST's proprietary STripFETTM technology. This is suitable for the most demanding DC-DC converter application where high efficiency is to be achieved.
Internal schematic diagram
Applications
Switching applications - Specifically designed and optimized for high efficiency DC/DC converters - OR-ing
Order code
Part number STB230NH03L Marking B230NH03L Package DPAK Packaging Tape & reel
June 2007
Rev1
1/13
www.st.com 13
Contents
STB230NH03L
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................. 6
3 4 5 6
Test circuit
................................................ 8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
STB230NH03L
Electrical ratings
1
Electrical ratings
Table 1.
Symbol VDS VGS ID(1) ID(1) ID(2) IDM
(3)
Absolute maximum ratings
Parameter Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC=100C Drain current (continuous) at TC=25C Drain current (pulsed) Total dissipation at TC = 25C Derating factor Value 30 20 250 178 80 1000 300 2 -55 to 175 Unit V V A A A A W W/C C
PTOT(4)
TJ
Operating junction temperature
1. This value is silicon limited 2. This value is limited by package 3. Pulse width limited by safe operating area 4. This value is rated according to Rthj-c
Table 2.
Symbol RthJC RthJA Tl
Thermal data
Parameter Thermal resistance junction-case max Thermal resistance junction-ambient max Maximum lead temperature for soldering purpose Value 0.5 62.5 300 Unit C/W C/W C
Table 3.
Symbol IAS EAS(1)
Avalanche data
Parameter Avalanche current Single pulse avalanche energy Value 60 1150 Unit A mJ
1. Starting Tj=25C, ID=IAV, VDD=24V
3/13
Electrical characteristics
STB230NH03L
2
Electrical characteristics
(TCASE=25C unless otherwise specified) Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on)
On/off states
Parameter Drain-source breakdown voltage Test conditions ID = 1mA, VGS= 0 Min. 30 1 10
100
Typ.
Max.
Unit V A A nA V m
VDS = 30V, Zero gate voltage drain current (VGS = 0) VDS = 30V,Tc=125C Gate body leakage current (VDS = 0) VGS = 20V 1 1.5 2.3
Gate threshold voltage VDS= VGS, ID = 250A Static drain-source on resistance VGS= 10V, ID= 40A
2.5 3
Table 5.
Symbol Ciss Coss Crss Qg Qgs Qgd RG
Dynamic
Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions Min. Typ. 4700 1600 85 72 15 11 Max. Unit pF pF pF nC nC nC
VDS =10V, f=1 MHz, VGS=0
VDD=15V, ID = 60A VGS =10V (see Figure 13) f=1 MHz Gate DC Bias = 0 Test signal level = 20mV open drain
Gate input resistance
5.5
4/13
STB230NH03L
Electrical characteristics
Table 6.
Symbol td(on) tr td(off) tf
Switching times
Parameter Turn-on delay time Rise time Test conditions VDD=15V, ID=60A, RG=4.7, VGS=10V (see Figure 12) VDD=15V, ID=60A, RG=4.7, VGS=10V (see Figure 12) Min. Typ. 11 322 Max. Unit ns ns
Turn-off delay time Fall time
123 102
ns ns
Table 7.
Symbol ISD (1) ISDM
(2)
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD=40A, VGS=0 ISD=120A, di/dt = 100A/s, VDD=20V, Tj=25C (see Figure 17) ISD=120A, di/dt = 100A/s, VDD=20V, Tj=150C (see Figure 17) 42 34.7 1.6 Test conditions Min. Typ. Max. 250 1000 1.3 Unit A A V ns nC A
VSD(3) trr Qrr IRRM trr Qrr IRRM
Reverse recovery time Reverse recovery charge Reverse recovery current
47 41.3 1.8
ns nC A
1. This value is silicon limited 2. Pulse width limited by safe operating area 3. Pulsed: pulse duration=300s, duty cycle 1.5%
5/13
Electrical characteristics
STB230NH03L
2.1
Figure 1.
Electrical characteristics (curves)
Safe operating area Figure 2. Thermal impedance
Figure 3.
Output characteristics
Figure 4.
Transfer characteristics
Figure 5.
Static drain-source on resistance
Figure 6.
Normalized BVDSS vs temperature
6/13
STB230NH03L Figure 7. Gate charge vs gate-source voltage Figure 8.
Electrical characteristics Capacitance variations
Figure 9.
Normalized gate threshold voltage vs temperature
Figure 10. Normalized on resistance vs temperature
Figure 11. Source-drain diode forward characteristics
7/13
Test circuit
STB230NH03L
3
Test circuit
Figure 13. Gate charge test circuit
Figure 12. Switching times test circuit for resistive load
Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test switching and diode recovery times circuit
Figure 16. Unclamped inductive waveform
Figure 17. Switching time waveform
8/13
STB230NH03L
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
9/13
Package mechanical data
STB230NH03L
D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA
mm. DIM. MIN. A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 0 4.88 15 1.27 1.4 2.4 0.4 4 10 8.5 5.28 15.85 1.4 1.75 3.2 0.192 0.590 0.050 0.055 0.094 0.015 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 8 10.4 0.393 0.334 0.208 0.625 0.055 0.068 0.126 TYP MAX. 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 MIN. 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 0.315 TYP. MAX. 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 inch
3
1
10/13
STB230NH03L
Packaging mechanical data
5
Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM. A B C D G N T 1.5 12.8 20.2 24.4 100 30.4 26.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0795 0.960 1.039 3.937 1.197 BULK QTY 1000 inch MIN. MAX. 12.992
TAPE MECHANICAL DATA
DIM. A0 B0 D D1 E F K0 P0 P1 P2 R T W mm MIN. 10.5 15.7 1.5 1.59 1.65 11.4 4.8 3.9 11.9 1.9 50 0.25 23.7 24.3 MAX. 10.7 15.9 1.6 1.61 1.85 11.6 5.0 4.1 12.1 2.1 inch MIN. MAX. 0.413 0.421 0.618 0.626 0.059 0.063 0.062 0.063 0.065 0.073 0.449 0.456 0.189 0.197 0.153 0.161 0.468 0.476 0.075 0.082 1.574 0.35 0.0098 0.0137 0.933 0.956
BASE QTY 1000
* on sales type
11/13
Revision history
STB230NH03L
6
Revision history
Table 8.
Date 08-Jun-2007
Revision history
Revision 1 Initial release. Changes
12/13
STB230NH03L
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